Thin substrate fabrication using stress-induced spalling

ABSTRACT

Manufacturing a thin film direct bandgap semiconductor active solar cell device comprises providing a source substrate having a surface and disposing on the surface a stress layer having a stress layer surface area in contact with and bonded to the surface of the source substrate. Operatively associating a handle foil with the stress layer and applying force to the handle foil separates the stress layer from the source substrate, and leaves a portion of the source substrate on the stress layer surface substantially corresponding to the area in contact with the surface of the source substrate. The portion is less thick than the source layer. The stress layer thickness is below that which results in spontaneous spalling of the source substrate. The source substrate may comprise an inorganic single crystal or polycrystalline material such as Si, Ge, GaAs, SiC, sapphire, or GaN. The stress layer may comprise a flexible material.

RELATED APPLICATION

The present application is a Non-Provisional Continuation Applicationwhich claims the benefits of and is based on Non-Provisional Parentapplication Ser. No. 12/784,688, filed May 21, 2010 now U.S. Pat. No.8,247,261 which claims the benefits of and is based on ProvisionalApplication Ser. No. 61/185,247 filed Jun. 9, 2009, the contents of saidParent Application and said Provisional Application being incorporatedherein by reference in their entirety.

FIELD OF THE INVENTION

The field of the invention is photovoltaic devices such as solar cells,and particularly substrate fabrication for photovoltaic devices usingstress induced substrate spalling.

BACKGROUND OF THE INVENTION AND RELATED ART

The field of photovoltaics (PVs) is primarily concerned with maximizingthe conversion efficiency of photon energy into electrical energy underthe constraint of minimum cost. The resulting figure of merit of a givenphotovoltaic technology is therefore cost per Watt. Therefore, some ofthe driving forces for innovation in PVs comprise increasing theefficiency of the solar cell device (or system), decreasing materialscosts, or decreasing processing costs. Additionally, the industry islooking to increase the versatility of photovoltaic (PV) materials toaddress other market needs. An example of this is integrating flexiblesolar cells into architectural or structural materials or othernon-standard solar panel applications. Although efforts have been madeto develop this technology, the materials used do not permit highefficiency energy conversion. For these reasons, there remains a needfor a method of fabricating low-cost, high efficiency PV substrates thatcan be used to 1) increase the cost per Watt value of conventional PVtechnology or 2) permit fabrication of novel, high-efficiency PVmaterials that are flexible and can be used to produce new PV products.

The related art describes various methods for producing thin filmmaterials used in the manufacture of PVs, or similar devices by variousmethods such as peeling, e.g., Shimoda, et al., U.S. Pat. No. 6,887,650;(wane, et al., U.S. Pat. No. 6,682,990; Mizutani, et al., U.S. Pat. No.6,802,026; Nagakawa, et al., U.S. Pat. No. 6,452,091; Seki et al. U.S.Pat. No. 5,000,816; and Sumi., U.S. Pat. No. 4,855,012.

A different technique has been used recently [F. Dross et al., Appl.Phys. A, 89 (2007) p. 149] to fabricate a thin single-crystal Si layerfrom a thicker source substrate using the “spontaneous” spallingresulting from thick Ag and Al bi-layers and high temperature annealingto create tensile strain through thermal expansion mismatch. The problemwith this approach is twofold; first, the high temperature step limitsthe ability to integrate partially (or fully) processed PV devices(devices with formed dopant junctions or metallization) with thespalling process (due to excessive dopant diffusion and incompatibilityof most metals with high temperature) and adds cost to the materials;and second, spontaneous spalling leads to poorly controlled fracture,physical curling of the stressor layer/exfoliated semiconductor layercombination, and the requirement for very thick stressor layers toself-initiate fracture in the substrate.

SUMMARY OF THE INVENTION

The present invention comprises processes, structures or articles ofmanufacture, materials, compounds, and compositions of matter, thataddress these needs to not only provide advantages over the related art,but also to substantially obviate one or more of the foregoing and otherlimitations and disadvantages of the related art by providing a methodof fabricating low-cost, high efficiency PV substrates that can be usedto increase the cost per Watt value of conventional PV technology orpermit fabrication of novel, high-efficiency PV materials that areflexible and can be used to produce new PV products.

Not only do the written description, claims, abstract of the disclosure,and the drawings that follow set forth various features, objectives, andadvantages of the invention and how they may be realized and obtained,but these features, objectives, and advantages will also become apparentby practicing the invention.

To achieve these and other advantages, and in accordance with thepurpose of the invention as embodied and broadly described herein, theinvention not only comprises thin, high efficiency, low cost PVsubstrate fabrication processes that employ stress induced substratespalling, but also, thin substrate structures or articles of manufactureproduced by this process, as well as materials, compounds, andcompositions of matter used in the process and article of manufacture.These PV substrates increase the value on a cost per Watt basis ofconventional PV technology and/or permit fabrication of novel,high-efficiency PV materials that are flexible and can be used toproduce new PV products.

The present invention provides a method for fabricating a thin (lessthan 100 um thick) semiconductor from a thicker source substrate using anew approach to controlled surface layer removal. Specifically, thepresent invention describes a method of controlling surface layerremoval that can occur through a process known as substrate spalling. Insubstrate spalling, a layer of metal under tensile strain is depositedon the surface of a substrate. If the stressor layer is made thickenough, the stress at the edge of the stressor layer/source substrateinterface, e.g., metal layer/substrate interface exceeds the fracturestrength of the substrate and a fracture propagates into the sourcesubstrate and propagates at a distance below, and parallel to, thesurface of the source substrate. Under the proper mechanical conditions(brittle substrate, tensile strain in stressor layer), the fracture willnot propagate through the source substrate but rather it will propagateparallel to the surface of the stressor layer/source substrate interfaceand a portion of the source substrate surface will “peel” off as asurface layer of the source substrate while remaining attached to thestressor layer.

One embodiment of the invention comprises a PV precursor single crystalor polycrystalline substrate having a surface with a stressor layeroperatively associated with the surface. The stressor layer comprises astressor layer surface in contact with the surface of the substrate,extending in a direction away from the surface of the substrate, and isoperatively associated with a handle layer disposed on the stressorlayer to move in a direction away from the surface of the substrate.Pulling the handle layer away from the substrate removes the stressorlayer. A portion of the substrate within the vicinity of the surface ofthe substrate is removed from the substrate by remaining on the surfaceof the stressor layer as the stressor layer is pulled away from thesubstrate, i.e., the portion is disposed on the stressor layer surface.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings also set out the invention and areincorporated in and constitute a part of the disclosure along with thisspecification and are included to illustrate various embodiments of theinvention and together with this written description also serve toexplain the principles of the invention. These drawings are, however,not necessarily drawn to scale.

In the drawings:

FIG. 1 comprises a side elevation in cross section of a source substratecomprising an inorganic material, alloy, or compound (e.g., Si, Ge,GaAs, SiC, sapphire, GaN) which is a single crystal or polycrystallinematerial, alloy, or compound (any orientation).

FIG. 2 comprises a side elevation in cross section of a deposited stresslayer or layers, extending from and operatively associated with, i.e.,glued, adhered, or bonded to the source substrate, where the stresslayer or layers comprise at least one of an (optional) adhesion layercomprising Ti/W, Ti, Cr, Ni, and the like, about 5 nm (nanometers) toabout 500 nm thick, adhered to said source substrate followed by atleast one of a stress-containing layer comprising for example Ni, Cr,Fe, and the like, about 1 um (micron) to about 50 um thick.

FIG. 3 comprises a side elevation in cross section of an attach handlefoil comprising a plastic or metal foil, extending from and operativelyassociated with, i.e., glued, adhered, or bonded to a stress layer ofthe invention, where the glue, adhesion agent or bonding agent and thelike may comprise an epoxy resin, thermocompression bonding or art-knownequivalent.

FIG. 4 comprises a side elevation in cross section showing mechanicalforce-induced spalling of the source substrate by lifting the stresslayer or layers by means of the attach handle foil according to thepresent invention.

FIG. 5 comprises a side elevation in cross section showing mechanicalforce-induced spalling of the source substrate along a fracture plane bylifting the stress layer or layers by means of the attach handle foilaccording to the present invention, where the fracture plane is embeddedin the source substrate and extends from the source substrate toward thestress layer and the attach handle foil.

FIG. 6 comprises a side elevation in cross section showing mechanicalforce-induced spalling of the source substrate along a fracture planewhere the fracture plane comprises processed layers or completeddevices. The force induced spalling is induced by lifting the stresslayer or layers by means of the attach handle foil according to thepresent invention.

The detailed description that follows further explains embodiments ofthe invention, and the advantages and features of the invention by wayof examples and with reference to the drawings.

DETAILED DESCRIPTION

To achieve these and other advantages, and in accordance with thepurpose of this invention as embodied and broadly described herein, thefollowing detailed embodiments can be embodied in various forms.

The specific processes, materials compounds, compositions, andstructural details set out herein not only comprise a basis for theclaims and a basis for teaching one skilled in the art to employ thepresent invention in any novel and useful way, but also provide adescription of how to make and use this invention.

The invention in one embodiment is a light weight and portablephotovoltaic device resistant to humidity, heat, and other outdoorenvironmental conditions and comprises a thin film direct or indirectbandgap semiconductor active solar cell device (thin film device)positioned on a flexible plastic, i.e., a flexible polymeric material,or other flexible material. This thin film device is furthercharacterized as comprising a single crystal or polycrystallinematerial, alloy, or compound (any orientation) layer less than 20microns thick (thin layer) having the active solar cell device depositedon it using the thin layer as a substrate. In another embodiment, thethin layer can also comprise the semiconductor active solar cell.Alternatively the entire solar cell structure is fabricated prior tobonding followed by transferring the solar cell structure to theflexible plastic carrier without need for further semiconductordeposition.

Flexibility is provided by a total semiconductor thickness less thanabout 20 um (microns) sandwiched between flexible plastic encapsulationlayers resistant to humidity, dust, or abrasion. The relationshipbetween maximum flexibility (minimum radius of curvature beforefracture) and the thickness of the semiconductor layers (either singlesemiconductor layer or multiple semiconductor layers that aremechanically coupled) can be estimated using mechanical models (A. W.Blakers and T. Armour, Solar Energy Materials and Solar Cells, Vol. 93,2009, p. 1440). The flexible plastic encapsulation layers can includethe flexible plastic used to transfer the thin semiconductor layer (thinlayer) Puncture resistance is provided by device redundancy: combiningmultiple cells in parallel and series configuration such that loss ofcells damaged by impact events results in low power loss by the overallarray. Low cost is provided by the use of very thin layers ofsemiconductor and the use of low cost processing.

The invented photovoltaic system is enabled using a breakthroughtechnique for low-cost layer transfer. This technique called “controlledspalling” requires deposition of only thin low-cost stressor layers(metal layer 6 and optional adhesion layer 4) on the source substrate 2and layer transfer can be achieved by simply pulling the surface of thesource substrate 2 onto a flexible substrate 8 or handle layer.

In one embodiment the “handle” layer 8 comprises means different thanthe stressor layer (layer 6) to initiate and propagate the spallingprocess. This allows for better fracture control and more versatility inhandling the exfoliated semiconductor layer 14. Metal layer 4 isoptional and serves as an adhesion layer. Certain metals such as Cr, Ti,and other metals and alloys have excellent adhesion properties and canbe used in situations where the stressor layer has poor adhesion to thesurface of the source substrate 2. Referring to FIGS. 1-2, one or moremetal layers 4 and 6 are deposited on a source substrate 2 (e.g., singlecrystal semiconductor) to a thickness that is less than that requiredfor spontaneous spalling (at room temperature, about 20° C.), but thickenough to permit mechanically assisted spalling using an external load.An example of an external loading technique that successfully leads tocontrolled spalling is to adhere a foil 8 (handle layer) to the surface10 of the metal 6 (i.e., tape foil 8 or handle layer 8 is operativelyassociated with the metallurgically bonded layers 4, 6) to form ametal/source substrate, followed by pulling the foil from the substrateto remove the thin surface layer from the source substrate as well. Thefoil 8 (i.e., handle layer 8) is required to be flexible, and shouldhave a minimum radius of curvature of less than 30 cm. If the foil layer8 is too rigid, the spalling process is compromised. A preferredmaterial for tape foil 8 comprises a polyimide.

The process and article of manufacture of the present invention havedistinct advantages over the spontaneous spalling of the prior art infour respects; first, the entire process can be completed at roomtemperature allowing for the removal of completed PV devices; second,the lower thermal budget reduces energy costs to produce the thinsubstrate; third, spalling can be performed at a time and in a manner ofconvenience rather than spontaneously, allowing more versatility inprocessing steps; and fourth, the thickness of the removed substratecomprising the thin surface layer 14 by can be controlled by adjustingthe thickness of the stressor layer. By contrast, in the spontaneousprocess the stressor layer must be thick enough to induceself-initiation, which does not allow for thinner stressor layers thatwould produce thinner removed layer substrates such as surface layer 14.

In one aspect, the thin stressor layer or layers, singly, or incombination are used at a thickness below that which results in thespontaneous spalling of the source substrate 2. The condition thatresults in spontaneous spalling is related to the simultaneouscombination of the stressor layer 6 thickness value and stress value, aswell as the mechanical properties of the source substrate 2. At a givenstressor layer 6 thickness value, there will be a stress value abovewhich spalling will occur spontaneously. Likewise, at a given stressorlayer 6 stress value, there will be a thickness value above whichspalling will occur spontaneously. An approximate guide for the stressorlayer thickness value at which spalling becomes possible for the casewhere the stressor layer 6 is substantially comprised of tensilestrained Ni is given by the relation t*=[(2.5×10⁶)(K_(IC) ^(3/2))]/σ²,where t* is the thickness value (in units of microns, um) of stressorlayer 6 at which controlled spalling becomes possible, K_(IC) is thefracture toughness value of the source substrate 2 (in units ofMPa·m^(1/2)), and σ is the magnitude of the stress value in stressorlayer 6 (in units of MPa, or megapascals). If the stressor layerthickness is greater than the value given by t* by approximately 50%,then spontaneous spalling may occur. In another aspect, the thicknessmay be anywhere from about 1 um to about 50 um, or from about 3 um toabout 30 um, or about 4 um to about 20 um thick. The thin stressor layeror layers comprise metal layer 6 as presently illustrated, but thiscomprises only one embodiment of this aspect of the invention. Otherembodiments include multiple thin stressor layers, e.g., up to aboutthree, or about four, or about five metal layers, or more, provided thatwhen taken together, they substantially fall within the thickness limitsset out above. As noted before, in one embodiment, the thin stressorlayer or layers comprise a low-cost thin stressor layer or layers.

Selection of the thin stressor layer or layers does not have to be basedon the difference between the coefficient of thermal expansion of thestressor layer or layers and the coefficient of thermal expansion of thesource substrate for promoting spontaneous spalling as in the prior art,where spalling is effected by cooling the structure from an elevatedtemperature (about 900° C.) to a lower temperature. The presentinvention does not rely on spontaneous spalling but rather the use ofmechanical force, and controlled fracture at substantially roomtemperature (about 20° C.) to separate the thin stressor layer or layersfrom the source substrate and remove a thin surface region ofcontrollable thickness from the source substrate. The thickness of theexfoliated semiconductor layer 14 in FIG. 4 from source substrate 2 isroughly twice the thickness value of the combined thickness values ofstressor layer 6 and optional adhesion layer 4. By controlling theamount of strain in the stressor layer 6, the operable thickness valueof stressor layer 6 (t*) can be chosen to remove a controlled thicknessof exfoliated semiconductor layer 14. For example, if an exfoliatedsemiconductor layer 14 thickness value of Si<111> was desired to beapproximately 8 um, then a Ni stressor layer 6 would need to beapproximately 4 um thick. By using the K_(IC) value for Si<111> (0.82MPa·m^(1/2)) the expression for t* above can be used to calculate that astress value of ˜700 MPa is required. Although the origin of the stressin the stressor layer 6 is intrinsic (originating from microstructure)and not due to coefficient of thermal expansion (CTE) stress, heatingstressor layer 6 often has the effect of increasing the stress value.This is due to microstructural changes within stressor layer 6 thatoccur upon annealing and is irreversible. Localized heating is thereforecontemplated to initiate fracture in the periphery of the area to belayer transferred. In other words, spontaneous spalling can be made tooccur in small, selected regions to help initiate fracture, e.g., byincreasing the thickness of the stress layer in these small selectedregions. Localized heating can be performed using a laser, remoteinduction heating, or direct contact heating.

We have demonstrated controlled layer transfer of various source layersincluding Si, Ge, and GaAs directly onto a flexible membrane (handlelayer 8 in FIG. 3) such as polyimide. Other art-known organic polymericmaterials can also be used for handle layer 8, such as polyethyleneterephthalae (PET), polycarbonates, ethylene polymers and copolymers,and fluorocarbon polymers and copolymers. This technique has thecapability of transferring any processed semiconductor layers ontoarbitrary substrates at room temperature in a manner that does not addsignificantly to the overall fabrication cost. Because the sourcesubstrate 2 can be re-processed and reused, this opens the door to alower cost pathway to high-efficiency cells based on crystalline Si orIII-V semiconductors. The use of this new technique to producehigh-efficiency solar cells on highly flexible films combined with amodule-level integration scheme that will optimize ruggedness and permitdiscrete cell failure makes this approach ideal.

Another embodiment of this invention comprises creating a fracture plane16 which we also refer to as a strained layer below the surface 12 ofthe source substrate 2. By creating the fracture plane 16 (a region withweaker bonding than the source substrate), the spalling has beenobserved to occur preferentially within the fracture plane 16. Thisresults in well-defined thickness of the exfoliated semiconductor layer14, smoother fractured surfaces, improved reusability of the sourcesubstrate 2 and a convenient method of exfoliating pre-processed layersin a well-controlled manner. Examples of fracture planes 16 compriseburied strained epitaxial layers (strained layers) optionally weakenedwith hydrogen exposure, ion-implanted regions, or deposited layerinterfaces obtained by processes well known in the art.

An example of a buried strained epitaxial layer 16 comprises the growthof a single-crystal SiGe alloy layer on the surface of a Si substrate,followed by the growth of a Si capping layer. If this structure isexposed to hydrogen plasma, the hydrogen collects at the strainedSiGe/Si interfaces and weakens the bonding at those interfaces. Thepresent inventors have successfully demonstrated preferential fracturealong buried, strained, and hydrogenated (using plasma exposure) SiGealloy layers grown on Si substrates. Additionally, the incorporation ofboron in these SiGe alloy layers improves the efficiency of hydrogentrapping at the strained layer interface 16 which we also refer to as afracture plane.

Accordingly we grow a strained layer or fracture plane 16 on acrystalline source substrate 2 (using CVD, MBE, or even evaporation). Asnoted, this can comprise a strained layer or fracture plane 16comprising SiGe on Si (the SiGe can be boron doped or undoped), followedby growing a thick Si cap layer (on top of the strained layer orfracture plane 16) that will be transferred, then subject the sourcesubstrate 2 obtained to a hydrogen source capable of transportinghydrogen into it (hot acid, ion implant, plasma exposure, hot wirehydrogenation, and the like). The hydrogen attacks the subsurfacestrained bonds in the region of the strained layer or fracture planeinterlaces, e.g., the interface between source substrate 2 and strainedlayer or fracture plane 16 thereby weakening the strained layer16/source substrate 2 interface. When we apply the controlled spallingtechnique described above to layer 6 and/or 4, initiation, peeling,fracture occurs with atomic scale precision at the weakened strainedlayer 16/source substrate 2 interface. Because the material is weakenedin the strained layer or fracture plane 16, fracture is easier (lessforce) and the metal layers 4, and/or 6 can be thinner (less than about3 um—thus less costly). The idea is that we grow the full solar cellstructure (The Processed Region of FIG. 6) over the strained layer orfracture plane 16, and simply peel it off, and we can reuse the sourcesubstrate 2.

In FIG. 6, region 18 comprises a Processed Region or completed devicesuch as formed p/n junctions, metal contacts, diodes, transistors,resistors and the like. More broadly, a Processed Region comprises aregion that has been altered from its initial state by doping, heating,or reacting with other elements, whereas a completed device comprises acollection of Processed Regions capable of performing electricaloperations.

An example of deposited layer interface 16 comprises single- orpoly-crystalline layers deposited using evaporation, sputtering,molecular beam epitaxy, or chemical vapor deposition techniques such asUHVCVD, MOCVD, RPCVD or APCVD, performed in such a manner that theinterface between the substrate 2 and the deposited layer 16 isimperfect. One such example is the growth or deposition of Si onto a Sisubstrate. Conditions may be chosen to leave a measurable quantity ofresidual oxygen, or carbon (or both) at the interface of substrate 2 andlayer 16, which can serve as the location of preferred fracture.Hydrogenation can further weaken these interfaces as well.

The basic concept that differentiates the present invention from priorart substrate spalling is that the prior art describes “spontaneousspalling”; namely, spalling obtained by the deposition of thick layers.This type of spalling requires large stress, mostly due to theinitiation and propagation of fracture to be driven by the metal layerdeposited on the source substrate that occurs when cooling the structuredown from 900 C. Because of the use of thick layers and a lot of stress,there is little control over the minimum thickness of the transferredlayers.

What we describe here is the deposition of much thinner metal layers onthe source substrate 2 (over a factor of about 10× thinner than theprior art) at low temperature (less than about 300° C., typically about100° C.), such that there is no spalling (film peeling) at this stage.Then we create a fracture initiation region (laser scribe near waferedge, e.g., the edge of the device in FIG. 2 between the sourcesubstrate 2 and the thin surface layer 14 or any technique that createsa small localized surface perturbation that acts as a fractureinitiation site), followed by bonding an adherent layer, e.g., foil 8(i.e., handle layer 8) to the surface 10 of the metal layer, such aslayer 6, of the metal layer/source substrate structure, and “peel” thelayer 6 (and optionally layer 4 in combination with layer 6) off byapplying mechanical force to the adherent layer 8 (or transfer medium).In practice we have used polyimide tape as layer 8 adhered to layer 6and peel off the layers 14, 6 (and optionally layer 4 in combinationwith layer 6). We have also demonstrated that employing a temporaryadhesion layer like water, or a gel between the surface 10 and aflexible membrane 8 (i.e., handle layer 8) followed by applying a forceto flexible membrane 8 away from source substrate 2 can remove thesurface layers 14, 6 (and optionally layer 4 in combination with layer6), and 8 and they are free standing (but coiled).

We apply the mechanical force to the layers 6 (and optionally layer 4 incombination with layer 6) in a direction away from the source substrate2 at an angle from about one degree up to about 180° to the plane of thesurface of source substrate 2 that is common with layer 6 (andoptionally layer 4 in combination with layer 6).

We have also demonstrated an advantage to propagating the fracture alongthe surface of a Si<001> substrate in any of the four ([100], [−100],[010], [0−10]) directions (orthogonal to the cleavage directions [110]).Fracture along these directions are much smoother and more consistent.

Thus, in one embodiment of the invention we deposit layer 6 (andoptionally layer 4 in combination with layer 6) less than about 10 um,but more than about 3 um of a metal, e.g., a metal comprising Ni on asource substrate 2, stick the tape 8 (i.e., handle layer 8) on thesurface of the metal, and pull off the surface layers 14, 6 (andoptionally layer 4 in combination with layer 6) and 8. This works wellon substrates comprising GaAs, Si, and Ge, as well as all substrateshaving crystal orientation <100> and <111>, although there is apronounced improvement when using <111> oriented wafers (naturalfracture plane) The improvements comprise smoother surfaces and thinnerNi layers for a given Ni stress value due to the reduced K_(IC) on thenatural fracture planes.

In other embodiments, the invention comprises providing a sourcesubstrate having a surface; disposing on the surface a layer comprisinga stress layer, the stress layer having a stress layer surface area incontact with and bonded to the surface of the source substrate;operatively associating a handle foil with the stress layer; andapplying a pulling force to the handle foil to separate the stress layerfrom the source substrate, and leave on the stress layer surface aportion of the source substrate substantially corresponding to the areain contact with the surface of the source substrate, where the surfaceportion is less thick than the source layer. Also, the layer comprisingthe stress layer may be at a thickness below that which results inspontaneous spalling of the source substrate.

The source substrate in this regard may comprise an inorganic singlecrystal or polycrystalline material, and the inorganic single crystal orpolycrystalline material may comprise Si, Ge, GaAs, sapphire, or GaN.

In a further embodiment we provide a source substrate having a surface;disposing on the surface a layer comprising a stress layer, the stresslayer having a stress layer surface area in contact with and bonded tothe surface of the source substrate; operatively associating a handlefoil with the stress layer; and applying force to the handle foil toseparate the stress layer from the source substrate, and leave on thestress layer surface a portion of the source substrate substantiallycorresponding to the area in contact with the surface of the sourcesubstrate, where the surface portion is less thick than the sourcelayer. The stress layer may comprise a deposited stress layer or layers,extending from and operatively associated with the source substrate,where the stress layer or layers may comprise an optional adhesion layerthat forms an interface with the source substrate operatively associatedwith at least one metal layer opposite the interface.

In other embodiments, the handle foil comprises a plastic or metal foil,extending from and operatively associated with the stress layer, such asflexible layer, e.g., a layer of polyimide. Additionally, we may providea fracture plane below the surface of the source substrate.

In a further embodiment we provide a method comprising providing asource substrate having a surface; disposing on the surface a layercomprising a stress layer, the stress layer having a stress layersurface area in contact with and bonded to the surface of the sourcesubstrate; operatively associating a handle foil with the stress layer;and applying force to the handle foil to separate the stress layer fromthe source substrate, and leave on the stress layer surface a portion ofthe source substrate substantially corresponding to the area in contactwith the surface of the source substrate, the portion being less thickthan the source layer; wherein the fracture plane comprises a growthinterface between the source substrate and the stress layer. Thefracture plane in this regard may comprise a plane below at least one ofa formed p-n junction, diode, transistor, resistor, or metal contact.

Throughout this specification, abstract of the disclosure, and in thedrawings, the inventors have set out equivalents, including withoutlimitation, equivalent elements, materials, compounds, compositions,conditions, processes, structures and the like, and even though set outindividually, also include combinations of these equivalents such as thetwo component, three component, or four component combinations, or moreas well as combinations of such equivalent elements, materials,compositions conditions, processes, structures and the like in anyratios or in any manner.

Although we employ the term “force,” which is the product of massmultiplied by acceleration, we intend, for the purpose of thisinvention, to use the term “force” broadly to also include torque, orpressure, i.e., any mechanical effort or any type of mechanical energyapplied to the layers to effect peeling where the force is applied byany prime mover known in the art such as an electric motor, or a heatengine, or fluid activated piston and cylinder means, or human effort,where the prime mover may be directly connected to or operativelyassociated with the layers or layer to be peeled, or connected oroperatively associated with the layers or layer to be peeled throughmechanical means comprising a rotating drum, or wheel, or lever, orwedge, or rack and pinion, or cylinder and piston means, and theart-known equivalents thereof, especially mechanical means that producea mechanical advantage.

Additionally, the various numerical ranges describing the invention asset forth throughout the specification also includes any combination ofthe lower ends of the ranges with the higher ends of the ranges, and anysingle numerical value, or any single numerical value that will reducethe scope of the lower limits of the range or the scope of the higherlimits of the range, and also includes ranges falling within any ofthese ranges.

The terms “about,” “substantial,” or “substantially” in any claim or asapplied to any parameters herein, such as a numerical value, includingvalues used to describe numerical ranges, means slight variations in theparameter. In another embodiment, the terms “about,” “substantial,” or“substantially,” when employed to define numerical parameter include,e.g., a variation up to five per-cent, ten per-cent, or 15 per-cent, orsomewhat higher or lower than the upper limit of five per-cent, tenper-cent, or 15 per-cent. The term “up to” that defines numericalparameters means a lower limit comprising zero or a miniscule number,e.g., 0.001. The terms “about,” “substantial” and “substantially” alsomean that which is largely or for the most part or entirely specified.The inventors also employ the terms “substantial,” “substantially,” and“about” in the same way as a person with ordinary skill in the art wouldunderstand them or employ them. The phrase “at least” means one or acombination of the elements, materials, compounds, compositions, orconditions, and the like specified herein, wherein “combination” isdefined above. The terms “written description,” “specification,”“claims,” “drawings,” and “abstract” as used herein refer to the writtendescription, specification, claims, drawings, and abstract of thedisclosure as originally filed, or the written description,specification, claims, drawings, and abstract of the disclosure assubsequently amended, as the case may be.

All scientific journal articles and other articles, including internetsites, as well as issued and pending patents that this writtendescription mentions including the references cited in such scientificjournal articles and other articles, including internet sites, and suchpatents, are incorporated herein by reference in their entirety and forthe purpose cited in this written description and for all otherdisclosures contained in such scientific journal articles and otherarticles, including internet sites as well as patents and the aforesaidreferences cited therein, as all or any one may bear on or apply inwhole or in part, not only to the foregoing written description, butalso the following claims, abstract of the disclosure, and appendeddrawings.

Applicants reserve the right to amend this specification and thedrawings filed herein without prejudice or disclaimer and in doing so,they do not disclaim, abandon, or forfeit any invention directly orindirectly represented thereby, and hereby rescind any implieddisclaimer that may be inferred from applicants' amendments orcancellation in the course of prosecution of this or any parent,continuation, continuing, continuation in part, divisional, terminallydisclaimed, or foreign patent application (related patent application orapplications), and specifically preserve all and any inventions embodiednot only by the original claims but also the written description,abstract of the disclosure, and drawings of this application and anyrelated patent application or applications, and preserve the right toprosecute claims to these inventions in any related patent applicationor applications filed prior to or subsequent to the filing of thisapplication.

Although the inventors have described their invention by reference tosome embodiments, other embodiments defined by the doctrine ofequivalents are intended to be included as falling within the broadscope and spirit of the foregoing written description, and the followingclaims, abstract of the disclosure, and appended drawings.

We claim:
 1. A method comprising: providing a source substrate having asurface; disposing on said surface a layer comprising a stress layer,said stress layer having a stress layer surface area in contact with andbonded to said surface of said source substrate; providing a fractureplane below the surface of said source substrate, wherein said fractureplane comprises a growth interface between said source substrate andsaid stress layer; operatively associating a handle foil with saidstress layer; and applying force to said handle foil to separate saidstress layer from said source substrate, and leave on said stress layersurface a portion of said source substrate substantially correspondingto said area in contact with said surface of said source substrate; saidportion being less thick than said source layer.
 2. The method of claim1 wherein said source substrate comprises an inorganic single crystal orpolycrystalline material.
 3. The method of claim 2 wherein saidinorganic single crystal or polycrystalline material comprises Si, Ge,GaAs, SiC, sapphire, or GaN.
 4. The method of claim 1 wherein saidhandle foil comprises a plastic or metal foil, extending from andoperatively associated with said stress layer.
 5. A method according toclaim 4 wherein said handle foil comprises a flexible layer.
 6. A methodaccording to claim 5 wherein said handle foil comprises a layer ofpolyimide.
 7. A method according to claim 1 wherein said fracture planecomprises a plane below at least one of a formed p-n junction, diode,transistor, resistor, or metal contact.
 8. A method according to claim 1wherein said layer comprising said stress layer is at a thickness belowthat which results in spontaneous spalling of said source substrate. 9.A method comprising: providing a source substrate having a surface;disposing on said surface a layer comprising a stress layer, said stresslayer having a stress layer surface area in contact with and bonded tosaid surface of said source substrate; operatively associating a handlefoil with said stress layer; and applying force to said handle foil toseparate said stress layer from said source substrate, and leave on saidstress layer surface a portion of said source substrate substantiallycorresponding to said area in contact with said surface of said sourcesubstrate, said portion being less thick than said source layer whereinsaid stress layer comprises a deposited stress layer or layers,extending from and operatively associated with said source substrate,and wherein said stress layer or layers comprise an optional adhesionlayer that forms an interface with said source substrate operativelyassociated with at least one metal layer opposite said interface.